PCB Assembly

    The INTEGRITY team takes all of your design and manufacturing requirements into account and builds them into one simple process. From the design phase, we will prepare a bill of materials and procure the part/components for the boards. No matter what quantities are involved, we manage all phases of production to deliver you a finished product.
     
    Our capabilities include:
    • Area Array Technology (BGA, CBGA, PGA,CGA)
    • BGA Re-balling
      Surface Mount Assembly (fine pitch components to 15Mil)
    • thru-Hole Assembly
    • In-Cicuit Test
    • Functional Test
    • Burn-in Testing
    • Conformal Coating
    • Potting/Encapsulating
    • Chassis Assembly
    • Retrofits and Upgrades
    • Cabling and Wiring

    QualityStandards:
     
      IPC-J-STD-001B (Certified instructor)
    • IPC-610-B
    • MIL-STD-2000
    • MIL-I-45208
    • ISO 9002 KEMA
    • MIL-STD-1686
    Share |


    << go back to previous page


             © INTEGRITY ENGINEERING & DESIGN SERVICES 2002 - 2013  |  SITE DESIGN & DEVELOPMENT BY READYWEBGO  webadmin