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PCB Assembly
The Integrity team takes all of your design and manufacturing requirements into account and builds them into one simple process. From the design phase, we will prepare a bill of materials and procure the part/components for the boards. No matter what quantities are involved, we manage all phases of production to deliver you a finished product. Our capabilities include: - Area Array Technology (BGA, CBGA, PGA,CGA)
- BGA Re-balling
Surface Mount Assembly (fine pitch components to 15Mil) - thru-Hole Assembly
- In-Cicuit Test
- Functional Test
- Burn-in Testing
- Conformal Coating
- Potting/Encapsulating
- Chassis Assembly
- Retrofits and Upgrades
- Cabling and Wiring
QualityStandards:
IPC-J-STD-001B (Certified instructor) - IPC-610-B
- MIL-STD-2000
- MIL-I-45208
- ISO 9002 KEMA
- MIL-STD-1686
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